London-based Soldo, a pay and spend automation platform provider, has raised $180 million in its new round of financing.

The Series C funding was led by Singaporean investment holding company Temasek with participation from new backers, Sunley House Capital, Advent International’s crossover fund and Citi Ventures.

Additionally, previous investors including Accel, Battery Ventures and Dawn Capital, also joined the round, which also received credit financing from Silicon Valley Bank.

With the new financing, Soldo will accelerate international expansion across Europe’s addressable market of $170 billion and product development.